以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
Airbnb didn’t buy houses. Uber didn’t buy cars. You just need to connect supply with demand. Build the platform, not the product, and scale without the cost.
，详情可参考搜狗输入法2026
Doohan revealed threats and abuse on Drive to Survive
tomshardware.com
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